Chip designer Broadcom expects to sell 1 million 3D stacked chips by 2027
Published on: Feb. 26, 2026, 7:39 p.m. | Source: The Economic Times
The company has refined the technology over five years to the point where its first customer, Fujitsu, is making engineering samples to test the design. Fujitsu plans to produce the stacked, or 3D, chips later this year.
